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Our Integrated Substrate manufacturing
Facility includes everything needed to take you circuit from layout
to prototype in the shortest time possible.These include:
- In-house laser Machining of substrates
and via drilling of dielectric tape
- In-house Annealing
- In house screen fab
- In house Print/Fire and Tape lamination
- In house conductor etch back
- In-house laser trimming of resistors and
capacitors
- In-house substrate continuity testing
- Fine pitch SMT
- Chip on Board using all major bonding technologies,
Wire Metals and Wire Sizes
- Full environmental and Electric Test, Including
active trim.
As a consequence we are able to
offer the following production ramp up times:
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Simple Circuit |
Complex Circuit |
| Prototype Phase |
1-2 Weeks |
6-12 Weeks |
| Pilot Phase |
3-4 Weeks |
12-16 Weeks |
| Production Phase |
Full
Scale Manufacturing |
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