APTA Fabricated Thick Film
APTA Fabricated LTCC (Low Temp Co-Fired Ceramic)
APTA Fabricated LTTT (Low Temp Transfer Tape) More information on LTTT
APTA Fabricated Etch Back Product
Third Party HTCC(High Temp Co-fired Ceramic)
Third Party Laminates (FR4, BT, etc)
Third Party Thin Film (Polyimide, SiO2)

Ceramics and Laminates in
Leaded Packages
LCC
BGA
CSP formats

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LTTT	Etch Back	LCC	BGA	CSP

2. Assembly Options

Fine Pitch SMT
Conductive Epoxy Die Attach
Non-Conductive Epoxy Die Attach
Eutectic Die Attach
Solder Die Attach
Automatic Gold Ball Bonding (.7-2.0 mil)
Automatic Gold Wedge Bonding (.7-2.0 mil)
Automatic Aluminum Wedge (.7-2.0 mil)
Automatic High Power Aluminum (3-20 mil)
Auto Encapsulation
Ring Frame Attach
Epoxy Lid Attach
Solder Lid Seal
Hermetic Seam Sealing

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SMT	Solder Die Attach	Wire Bond	Encapsulation	Ring Frame Attach	Seam Sealing

Burn-In
Substrate Continuity Testing (Bed of Nails or Flying Probe)
Analog/ Digital/ Mixed Signal Testing
Medium Frequency RF
Custom Electrical Test Program Development (Lab view)
Temperature Cycling
Constant Acceleration
Fine/Gross Leak
PIND