APTA

Substrate and Pin Out Options

LTTT \| Etch Back \| LCC \| BGA \| CSP
	LTTT
	Low Temperature Transfer Tape is laminated to either an alumina or beryllium base substrate. There is no X-Y shrinkage and using .003 inch lines, spaces and via diameter density is greatly increased. A beryllium base package is able to dissipate up to 20 watts per square inch. More information on LTTT
	Gold Etch
	A thin print gold pattern is imaged using a photo resist and etching chemicals to create lines and spaces less than .001 inch.
	LCC
	Lead-less Chip Carriers use solder coated pads for attaching to a printed circuit board.
	BGA
	Ball Grid Array is the latest volume production high density packaging method . Ball pitch ranges from 0.5mm to 1.27mm. Multilayer circuitry and multiple components can be assembled on them.
	CSP
	A BGA Chip Scale Package uses a substrate no larger than the die and associated wire bond pads.