APTA - Advanced Packaging Technology of America













 

MCM-C    Ceramic Multichip Modules

 

Application example

 

   
  • 0.85 x 0.75 Inch Circuit
  • Transmission Lines
  • Alumina Base
  • 4 mil lines/spaces
  • 4 mil vias 6 layers
  • 275 vias/Sq. inch
  • 10 Integrated Resistors
  • 10 Integrated Capacitors, trimmed to match outputs
  • 15 passive, 2 Custom high Wattage IC’s
  • Edge Connections 25mil pitch

 


Index