APTA - Advanced Packaging Technology of America













 

MCM-C    Ceramic Multichip Modules

Table of Contents

Materials Description

Step Discussion

Comparison of Process Steps

Conductor Performance

Design Specifications

Transmission Lines

75 Micron Wide Transmission Line

Stripline Using Fine Grind Gold
and K=4.1 Transfer Tape

Stripline

Microstrip

Buried 1K ohm Resistors

Capacitors

MCM Technology Comparison

MCM Technology Comparison pg. 2

Thermal Coefficient of Expansion

Technology Advantages

Application Example

 

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