APTA - Advanced Packaging Technology of America













 
Microminiature Electronic Packaging (MEPSM)

APTA is evolving MEPSM into a System on Package (SOP) approach. We expect the System on Chip (SOC) approach, or WSI (Wafer Scale Integration) to become pervasive, over the next few years especially in fairly homogeneous systems. We also envision large demand in the future for heterogeneous electronic systems consisting of high frequency RF front ends, high speed digital (DSP) or ASIC processors , memories, sensors and displays in an ultra dense form factor.

Our aim is to provide cost effective packaging to accommodate these types of heterogeneous systems, in a form factor, and with electrical, thermal and time to market performance competitive with a pure System on Chip approach and as a complimentary alternative to SOC.


APTA is evolving the SOP approach around 3 key technologies
Transfer Tape Substrate Technology
Flip Chip IC mount
BGA/CSP Pin out
Our Ultra-Flexible LTTT, Low Temperature Transfer Tape Process allows us to fabricate, Substrates (Interconnects) with the following desirable properties;

Small vias and lines/spaces (75 microns or less)
Low k (4.5) /low loss ceramic dielectric
High Conductivity Low cost Silver Conductors
Stacked Vias
Solid or gridded Ground Planes
Integrated Resistors, Inductors, and Capacitors with reasonable values and tolerances
Integrated heat sinks of different materials, metal, beryllia or ceramic for superb thermal management
Attach seal rings, leads for peripheral I/O or balls for BGA/CSP ultra high I/O counts

During the past 3 years, APTA has built thousands of circuits incorporating some or all of these features. We are continuously reducing cost and improving cost/performance ratio of this technology. Please click here for detail on LTTT.


APTA is perfecting the following Flip Chip Technologies to support our System on Package approach:
Gold Stud Bump Flip Chip
Copper Stud Bump Flip Chip
Solder Ball Flip Chip

Please see our Products and Services Page for Direct Chip Attach Processes currently in production, and our Design Guidelines Page for more details on MEPSM technologies.