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Process Engineer Reports to: Director of Engineering Description: Develops and maintains new processes for manufacturing of microelectronic circuits Duties: Responsible for developing new processes, maintaining them and to train operators to use them. Processes such as stud bumps, underfill epoxies, photo imaging, metal substrates among others. Also responsible for supporting the programming, and setting up automated manufacturing equipment and training production operators. Such as surface mount pick and place machines, automated dispensing equipment, solder paste printing, solder reflow and cleaning. Also, semiconductor manufacturing equipment such as automatic wire bonders, die attach, package seam sealing, fine and gross leak testing and environmental screening equipment. Requirements: Bachelor of Science degree. Five years experience with process development of various materials for the microelectronics industry. Experience with automatic, surface mount pick and place equipment and surface mount assembly. Intimate knowledge of computer programming and semiconductor automatic wire bonding and assembly processes. Contact: Bonnie Daniels
Phone:
(619) 710-8170 Ext 26
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