|
SMT | Solder
Die Attach | Wire Bond | Encapsulation
| Ring Frame Attach | Seam
Sealing
|
 |
SMT
|
| "J"
leaded edge pins provide Surface Mount Technology packages that
can be assembled directly to a printed circuit board. APTA's
capability for automatic surface mounting of components includes
fine pitch TSOP packages and 0402 chip components. |
 |
Solder
Die Attach
|
| High
power semiconductor devices can be solder attached to dissipate
heat. APTA has also developed a superior high strength solder
attach process to withstand the rigors of spade lug connectors.
|
 |
Wire Bond
|
| APTA's
automatic wire bonding capability includes both gold and aluminum
wire. Gold is available in diameters from .0007 to .002 inches
and aluminum from .0007 to .020 inches. |
 |
Encapsulation
|
| The
components on a Laminate BGA are protected by an epoxy encapsulation.
|
 |
Ring Frame
Attach
|
| A
Kovar Ring Frame is attached to the substrate base using a high
temperature alloy. The cover is either solder attached or seam
sealed. |
 |
Seam
Sealing
|
| Lid
and Package Vacuum Baked to eliminate moisture and oxygen. While
inside Vacuum Chamber, cover is welded to seal ring along the
perimeter to create hermetic package. |
